Urgent.News

What's breaking now, across thousands of outlets.

World

Business : ERS electronic Unveils Automated Panel-Level Packaging System

KUALA LUMPUR, Oct 1 (Bernama) -- ERS electronic, a provider of thermal management solutions for semiconductor manufacturing, has introduced a fully automated panel-level packaging (PLP) system for 310×310 mm substrates, integrating temporary carrier bonding, debonding and detaping on a single platform.

We haven't written up this one. Bernama has the full story — the link below goes straight to it.

Read the original at bernama.com →

More in World

More from Thursday 1 October →