SK hynix Deepens AI Memory Collaboration with TSMC, Extending Roadmap from HBM4 to HBM5

SK hynix has strengthened its collaboration with TSMC to develop next-generation AI memory and advanced packaging technologies. The partnership was highlighted at the TSMC Open Innovation Platform (OIP) Forum in Santa Clara, California, on September 23, where SK hynix showcased a wide range of AI memory products. These included high-bandwidth memory (HBM), server DRAM, and enterprise solid-state drives (eSSDs).

The company's presentation, titled "The Memory behind the Intelligence at Scale," emphasized the crucial role of memory in powering increasingly powerful AI computing systems. Notable SK hynix products featured alongside NVIDIA's next-generation AI superchip platform, Vera Rubin, included a 36GB 12-layer HBM4 and a 96GB SOCAMM2.

SK hynix also displayed an expanded HBM lineup, featuring a 48GB 12-layer HBM4E, a 48GB 16-layer HBM4, a 36GB 12-layer HBM3E, and a 192GB SOCAMM2. These products underscore the growing demand for high-capacity, power-efficient memory in AI server systems. Additionally, SK hynix presented server DRAM products, such as a 256GB 3DS RDIMM, a 128GB MRDIMM, and a 64GB RDIMM, based on its sixth-generation 10-nanometer-class process technology.

For enterprise storage, SK hynix showcased the PEB210 E1.S, a liquid-cooled solution, and the PS1101 E3.S, a QLC-based enterprise SSD. This expanded product portfolio reflects the increasing importance of memory bandwidth and storage capacity in AI data centers. SK hynix's partnership with TSMC has also advanced to the next generation of HBM technology.

The company received TSMC's Partner of the Year award in the "3DFabric-HBM Integration" category for the second year in a row, recognizing their collaborative work on validating next-generation HBM5 using TSMC's CoWoS advanced packaging technology. Advanced packaging is becoming crucial as HBM performance increases, enabling closer integration between memory and computing chips for future AI accelerators.

By expanding its AI memory and advanced packaging offerings while partnering with TSMC, SK hynix is positioning itself for the next phase of AI infrastructure development.