TSMC Plans Five More Packaging Plants in Taiwan
Taiwan’s TSMC, the world’s largest foundry (semiconductor contract manufacturing) company, is reportedly pushing to build five additional state-of-the-art packaging plants at the Chiayi Science Park in Chiayi County, southern Taiwan. If realized, 10 advanced packaging plants of TSMC will be located
Taiwan’s TSMC, the world’s leading semiconductor contract manufacturer, is set to construct five additional cutting-edge packaging plants at the Chiayi Science Park in southern Taiwan, a move that could turn the site into the global hub for advanced packaging. According to a report by the Taipei Times, citing Liberty Times, TSMC plans to boost its investment and increase the total number of packaging plants at the park to ten, solidifying its status as the premier advanced packaging hub in the world.
The 10 plants will include Plant 3 to Plant 5, which construction has already commenced, with completion slated for 2031. The surge in demand for TSMC’s advanced packaging technology, particularly the ‘Chip on Wafer on Substrate’ (CoWoS) used in artificial intelligence semiconductors and high bandwidth memory, has driven the need for expansion.
CoWoS, which integrates AI chips with high bandwidth memory, is a crucial technology for fields such as AI, heterogeneous packaging, silicon photonics, beyond 5G and 6G communications, quantum technology, and carbon neutrality. TSMC’s capital expenditure forecast for this year has been raised from $52-$56 billion to $60-$64 billion.
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