SK hynix Verifies HBM5 with TSMC
SK hynix said on Sept. 28 that it took part in the “TSMC Open Innovation Platform (OIP) Conference,” held in Santa Clara, California, on Sept. 23 local time, where it introduced next-generation artificial intelligence memory products and its development strategy.OIP is an open innovation platform op
On September 28, SK hynix confirmed its participation in the "TSMC Open Innovation Platform (OIP) Conference," held in Santa Clara, California, on September 23. The event showcased next-generation AI memory products and development strategies. SK hynix received the Partner of the Year award in the "3DFabric-HBM Integration" category for its collaboration in validating HBM5 using TSMC's advanced packaging technology, Chip on Wafer on Substrate (CoWoS).
This marks the company's second consecutive year receiving the award. As HBM evolves, the number of stacked layers and data processing speeds increase, necessitating advanced packaging technology for AI accelerators. SK hynix and TSMC have validated packaging compatibility and performance since early HBM5 development. The conference featured SK hynix's lineup of AI infrastructure products, including HBM, server DRAM, and enterprise solid-state drives.
Notable products included NVIDIA's "Vera Rubin" superchip with SK hynix's 12-layer 36GB HBM4 and 96GB SOCAMM2. SK hynix also displayed next-generation products like 12-layer 48GB HBM4E, 16-layer 48GB HBM4, 12-layer 36GB HBM3E, and 192GB SOCAMM2. Server DRAM products included the 256GB 3DS RDIMM and high-bandwidth 128GB MRDIMM. In the enterprise SSD exhibition, SK hynix showcased the "PEB210 E1.S," supporting direct liquid cooling, and its first QLC-based eSSD, the "PS1101 E3.S."
SK hynix projects a threefold growth in the PCI Express-based eSSD market from 509EB in 2026 to 1933EB in 2030 due to AI infrastructure expansion. They are preparing a chiplet-based next-generation solution for PCIe Gen 6 and Gen 7 products, connected through UCIe to shorten development time and optimize capacity and power.
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