SK hynix Verifies HBM5 with TSMC
SK hynix said on Sept. 28 that it took part in the “TSMC Open Innovation Platform (OIP) Conference,” held in Santa Clara, California, on Sept. 23 local time, where it introduced next-generation artificial intelligence memory products and its development strategy.OIP is an open innovation platform op
SK hynix recently verified the HBM5 memory technology with TSMC at the TSMC Open Innovation Platform (OIP) Conference held in Santa Clara, California. The company received the Partner of the Year award in the “3DFabric-HBM Integration” category for its collaborative achievement in validating HBM5 based on TSMC’s advanced packaging technology, Chip on Wafer on Substrate (CoWoS).
This is the company's second consecutive year receiving the award. At the event, SK hynix showcased a range of AI infrastructure products, including HBM5-equipped NVIDIA’s Vera Rubin superchip and SK hynix's 12-layer 36GB HBM4 and 96GB SOCAMM2.
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