Samsung Electro-Mechanics to invest $3.14 bil. for substrate plant in Sejong
Samsung Electro-Mechanics said Monday it will invest 4.27 trillion won ($3.14 billion) to expand its semiconductor substrate production capacity at its plant in Sejong, marking the largest amount of capital expenditure on a single product in the company’s history. According to its regulatory filing, the company will expand its production capacity for flip chip ball grid array (FC-BGA) substrates…
Samsung Electro-Mechanics plans to invest $3.14 billion in expanding its semiconductor substrate manufacturing capacity at its Sejong plant, the largest single investment in the company's history. The expansion aims to meet the rising demand for flip chip ball grid array (FC-BGA) substrates, which are crucial for powering AI servers, graphics processing units, and central processing units.
The investment, spanning from September 2026 to May 2028, will see the beginning of mass production in September 2028. This move is part of Samsung's broader commitment to invest 8 trillion won in the central Chungcheong region and 15 trillion won in the Busan area by 2040. FC-BGA substrates are highly integrated components that connect advanced chips to mainboards, facilitating the transmission of electrical signals and power.
Written by urgent.news from The Korea Times's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
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