Hong Kong tech chief sets June deadline for Hetao cross-border talent flow
Cross-boundary talent flows within the Hetao innovation hub will be launched by June next year at the latest, Hong Kong’s technology minister has said, after the city leader pledged to enable the free movement of data by the end of this year. Speaking on a radio programme on Sunday, Innovation, Technology and Industry Secretary Sun Dong gave the first deadline for the scheme, also saying…
Hong Kong's technology minister, Sun Dong, has announced a June 30 deadline for the commencement of cross-border talent flows within the Hetao innovation hub, following the city's pledge to enable free data movement by year-end. Speaking on a radio program, Sun highlighted that semiconductor production at the Hong Kong Microelectronics Research and Development Institute (MRDI) could result in scientific outcomes and facilitate mass production within the Greater Bay Area.
The Innovation, Technology and Industry Secretary also discussed the Northern Metropolis University Town, noting that 80% of Building 1 in the Hong Kong Park of the Hetao Shenzhen-Hong Kong Science and Technology Innovation Cooperation Zone has been leased. The park will host the United Nations Industrial Development Organisation's centre of excellence on global advanced manufacturing and the Life and Health Technology Research Institute headquarters in the second quarter of next year.
The government has received six bids for land parcels in the park's first phase, primarily from semiconductor, AI, and quantum technology companies. Sun explained that the zone's "one river, two banks" and "one zone, two parks" vision aims to facilitate efficient personnel, material, capital, and data flow between Hong Kong and Shenzhen.
Additionally, Sun announced that trial chip production at the MRDI would help enterprises address technical challenges and test products before large-scale manufacturing, emphasizing Hong Kong's role as a manufacturing hub. The institute, based at Yuen Long InnoPark, is expected to lead the operation of Hong Kong's first national manufacturing innovation centre, focusing on third-generation power semiconductors.
The government plans to establish a HK$10 billion innovation and technology industry-oriented fund by year-end, with private sector contributions aiming to reach HK$40 billion.
Written by urgent.news from South China Morning Post's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
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