Hong Kong tech chief sets June deadline for Hetao cross-border talent flow
Cross-boundary talent flows within the Hetao innovation hub will be launched by June next year at the latest, Hong Kong’s technology minister has said, after the city leader pledged to enable the free movement of data by the end of this year. Speaking on a radio programme on Sunday, Innovation, Technology and Industry Secretary Sun Dong gave the first deadline for the scheme, also saying…
Hong Kong's Technology Secretary, Sun Dong, has announced a deadline of June 30, 2025, for the launch of cross-border talent flows within the Hetao innovation hub. This follows the city's pledge to enable the free movement of data by the end of the year. The initiative aims to facilitate the movement of personnel, materials, capital, and data between Hong Kong and Shenzhen parks, forming a "north-central-south" development paradigm.
Additionally, the semiconductor production at the Hong Kong Microelectronics Research and Development Institute is expected to yield scientific results and pave the way for mass production in the Greater Bay Area.
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