Samsung and Solidigm join Global Memory Innovation Forum speaker lineup

Shenzhen, China will host the 5th Global Memory Innovation Forum (GMIF2026) on September 23 at the Renaissance Shenzhen Bay Hotel. This event, co-hosted by the Shenzhen Memory Industry Association and School of Integrated Circuits at Peking University, will focus on "The Future Built on AI Memory and Storage." The summit will bring together over 18 leading global companies and academic institutions, including Samsung Semiconductor, Sandisk, Solidigm, Silicon Motion, Arm, and others.

The aim is to discuss emerging trends, market strategies, AI application deployments, industry ecosystem collaboration, and capital value creation within the memory and storage industry. An exhibition area will showcase over 300 innovations from various sectors, providing a unique opportunity to explore the future of AI memory and storage technology.

Registration is now open for those interested in staying ahead of industry trends and networking with key players in the field. More information about the event can be found at https://www.gmif.com.cn/.