Wafer Inspection Market Set to Approach $10 Billion by 2030
AUSTIN, Texas, Sept. 21, 2026 (GLOBE NEWSWIRE) — AINewsWire Editorial Coverage: The artificial intelligence boom has moved its toughest bottleneck. It is no longer just about who can etch the smallest transistor. Increasingly, it is about who can package finished chips fast enough, cleanly enough and in high enough volume to keep AI data centers […]
The artificial intelligence boom is no longer solely about creating smaller transistors for chip etching; it has shifted focus to packaging finished chips quickly, accurately, and in large quantities to adequately supply AI data centers. NVIDIA CEO Jensen Huang has announced plans to increase the capacity for CoWoS-L, the advanced packaging process powering NVIDIA's latest chips, while simultaneously encouraging suppliers to improve yield and production speed.
This growing demand is also influencing the automation and inspection sector that underpins packaging lines, an area where TechForce Robotics, trading as Nightfood Holdings Inc. (OTCQB: NGTF), aims to compete. The company recently established TechForce Advanced Manufacturing, Inc., a majority-owned subsidiary in collaboration with a Taiwanese manufacturing partner, with the goal of boosting automated Wafer Sorter and AOI systems for 8-inch and 12-inch wafers.
The production and revenue for this initiative are slated to commence in the fourth quarter of 2026. Nightfood is targeting a position within the expanding AI/automation sector, alongside industry giants such as NVIDIA (NASDAQ: NVDA), Advanced Micro Devices (NASDAQ: AMD), Broadcom (NASDAQ: AVGO), and Micron Technology (NASDAQ: MU).
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