SK hynix Kwak Noh-jung: Next-Generation Memory to Extend AI Market Leadership Beyond HBM
SK hynix is looking beyond high-bandwidth memory (HBM) as it prepares next-generation memory technologies aimed at sustaining its competitiveness in the rapidly evolving artificial intelligence (AI) semiconductor market.Kwak Noh-jung, CEO of SK hynix, outlined the company’s technology strategy durin
SK hynix CEO Kwak Noh-jung outlined the company's strategy for next-generation memory technologies at the 2026 Global Forum, held on September 18 in Santa Clara, California. Kwak stressed the critical role of memory in AI infrastructure and the company's plan to build upon its HBM experience to develop advanced memory solutions that will support AI applications and computing demands.
SK hynix intends to bolster its manufacturing and research capabilities in response to the expanding AI market by investing in new production facilities, research infrastructure, and establishing an AI-focused R&D center in the United States. The company is also expanding its manufacturing footprint through the Yongin Semiconductor Cluster in South Korea and a new fab in Indiana.
During the forum, industry experts and researchers discussed the necessity of integrating chip design, process technology, advanced packaging, and system architecture to meet the evolving requirements of AI workloads. SK hynix showcased its current AI memory products, including HBM, and introduced new research papers from scholarship recipients at the forum.
The company sees next-generation memory, advanced packaging, and system-level technologies as crucial components for its continued success as AI computing evolves.
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