Samsung is expected to more than double output of its HBM4 and HBM4E DRAM

Samsung Electronics is projected to more than double production of its HBM4 and HBM4E DRAM chips next year, according to industry sources. The company plans to increase glass carrier demand by 2.5 times from the current month. Glass carriers are essential supports used in thinning HBM DRAM wafers. Samsung will boost outsourced glass carrier cleaning volume to 50,000 sheets per month in 2024, up from 20,000 sheets this year.

HBM4 and HBM4E technologies focus on 12-layer and higher stack counts, necessitating advanced wafer thinning and warpage control processes. The semiconductor industry anticipates Samsung's HBM output to nearly double, growing from 180,000 wafers this year to approximately 250,000 wafers in 2024.