India’s Chip Ambition Accelerates, 200 Design Companies Emerge Under Semiconductor Mission 2.0
New Delhi: India’s semiconductor ecosystem is expanding, with at least 200 chip design companies emerging under the India Semiconductor Mission 2.0 , according to Electronics and Information Technology Minister Ashwini Vaishnaw. The programme is expected to strengthen semiconductor intellectual property and reduce India’s dependence on imported chip technologies. Startups Gain Advanced Design…
New Delhi: According to Electronics and Information Technology Minister Ashwini Vaishnaw, India's semiconductor ecosystem is rapidly expanding, with at least 200 chip design companies emerging under the India Semiconductor Mission 2.0. The initiative aims to bolster semiconductor intellectual property and decrease India's reliance on imported chip technologies. Over 105 semiconductor startups have gained access to advanced Electronic Design Automation tools, with 20 startups securing venture capital funding.
India has trained around 70,000 chip design engineers in the past four years, bringing the nation closer to its goal of establishing a talent pool of 85,000 engineers. Five semiconductor plants approved under India Semiconductor Mission 1.0 have commenced commercial production, marking progress from project approvals to actual manufacturing and commercial output.
India's growing reputation as a dependable semiconductor partner and its track record of protecting intellectual property have contributed to the increased global interest in the country's semiconductor industry. At SEMICON India 2026, the minister emphasized that global competitiveness hinges on delivering high-quality products at competitive costs.
Foreign Secretary Vikram Misri highlighted the significance of resilient semiconductor supply chains, emphasizing the need for trusted international partnerships based on reliability, credibility, incentives, and value creation.
The India–Singapore roundtable, which brought together 142 participants, explored collaboration opportunities in manufacturing, advanced packaging, and supply-chain management. India's participation offered engineering skills and market scale, while Singapore contributed established manufacturing expertise. The India–Europe session, attended by 139 participants, focused on investment, equipment, materials, localisation, research, chip design, manufacturing, and talent development.
Finally, the India–South Korea roundtable, with 115 participants, discussed manufacturing, technology, materials, packaging, investment, and supply chains, underscoring the growing global interest in India's semiconductor ambitions and its aspiration to merge domestic capabilities with international expertise.
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