Huawei to launch two new AI chips in 2027

Huawei Technologies announced plans to launch two new artificial-intelligence semiconductors, the 960DT and Ascend 960PR, in 2027, according to rotating chairman David Wang. The company aims to challenge US chipmaker Nvidia in its AI computing business. Additionally, Huawei is developing technology to connect a large number of AI chips, enabling them to function as one larger computing system.

This technology, called UnifiedBus, would facilitate chips sharing information and working together more efficiently. Huawei has already developed 11 semiconductors using this technology for its large systems, with its largest linked systems, called superclusters, supporting up to one million AI processors. Smaller linked systems, known as supernodes, have been shipped to over 370 customers.

However, the number of chips that could be connected within a single supernode, the identity of customers, and the breakdown of shipments were not disclosed. The restrictions on China's access to advanced computing chips and semiconductor manufacturing equipment have prompted Chinese companies and policymakers to focus on developing domestic alternatives.