Huawei sets 2027 launch for new AI chips as it targets Nvidia

Huawei Technologies announced plans to launch two new artificial-intelligence semiconductors in 2027, aiming to challenge US chipmaker Nvidia, according to its rotating chairman David Wang. The 960DT will be released in the first quarter, followed by the Ascend 960PR in the third quarter. Huawei is also developing UnifiedBus technology to enable large numbers of AI chips to collaborate as one bigger computing system.

This technology would allow chips to share information and work together more efficiently. The company has already developed 11 semiconductors based on this technology for its large systems, capable of supporting up to 1 million AI processors. Huawei has also shipped more than 1,000 smaller linked systems, called supernodes, to over 370 customers.

The ability to connect chips has become crucial for Chinese tech companies, as they rely on domestic alternatives due to US export controls restricting access to advanced computing chips and semiconductor manufacturing equipment. Despite the competition from Nvidia, Huawei has built a strong developer base of 5,270 monthly active developers for its AI chip ecosystem.