Kelington bags RM1.83bil India chip-fab deal

Kelington Group Bhd has secured a provisional USD 452 million (RM1.83 billion) contract to provide turnkey total facility tool hookup services for a semiconductor wafer fabrication facility in Gujarat, India. The scope of the project covers the overall design, installation, connection, testing, and handover of manufacturing, laboratory, and support tools for Modules 1 and 2.

The final contract value will be determined based on the actual quantities of tools and services executed. The project is the largest secured by the group since its establishment and positions Kelington as a main contractor for turnkey total facility tool hookup services in the semiconductor industry.

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