Samsung and ASML Deepen Partnership to Advance High NA EUV Technology
Samsung Electronics and ASML are expanding their long-standing strategic partnership as the two companies step up cooperation on High NA EUV lithography and advanced semiconductor manufacturing technologies.The companies said they will strengthen joint efforts to develop and deploy next-generation m
Samsung Electronics and ASML are reinforcing their long-standing strategic partnership to accelerate the development of next-generation high NA EUV lithography and advanced semiconductor manufacturing technologies. The collaboration aims to meet the escalating performance and efficiency requirements of the semiconductor industry, driven by the surging demand for AI-related chips.
Under the expanded agreement, Samsung will actively participate in an industry-driven initiative to develop next-generation 12-inch photomask technology. Currently, the semiconductor sector predominantly utilizes 6-inch photomasks. Transitioning to larger 12-inch masks is anticipated to enhance fab productivity, lower chip production costs, and overcome stitching limitations when High NA EUV technology is employed.
This shift also promises to enable advanced chipmakers to maximize the potential of High NA EUV technology, potentially boosting the cost competitiveness of leading-edge semiconductor production.
Samsung, renowned for its expertise in memory and foundry manufacturing, along with advanced EUV processes, aims to collaborate with industry partners to devise the requisite mask technologies and related infrastructure for the transition. The company also intends to incorporate ASML's High NA EUV lithography technology into high-volume DRAM manufacturing by 2028, marking an industry first.
This development is poised to sustain DRAM scaling by offering higher resolution, simplifying manufacturing processes, and boosting production efficiency.
The enhanced partnership materializes as semiconductor manufacturers strive to expedite technology development in response to the rapidly increasing demand for AI-related chips. Both Samsung and ASML underscore their commitment to explore further collaboration avenues, encompassing advanced memory technologies and novel approaches to semiconductor manufacturing.
Young Hyun Jun, Samsung Electronics' vice chairman and CEO, emphasized the transformative impact of the AI era on the semiconductor industry and the critical role of innovation throughout the supply chain. Jun stated, "Samsung is dedicated to preserving leadership in advanced semiconductor manufacturing, including memory and foundry, through groundbreaking technologies and robust partnerships.
By further fortifying our alliance with ASML, we are laying the groundwork for the forthcoming generation of AI and semiconductor innovation."
Christophe Fouquet, ASML's president and CEO, echoed Samsung's sentiments, highlighting the company's enduring role as a pivotal innovation partner. Fouquet remarked, "Together, we have propelled the technologies that form the bedrock of contemporary semiconductor manufacturing. As the industry embarks on a new epoch propelled by artificial intelligence, the importance of close collaboration with our customers intensifies."
Written by urgent.news from Korea IT Times's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.