AI, chip firms among bidders for flagship Northern Metropolis tech hub at border
Hong Kong’s flagship tech hub at the border with mainland China received bids from firms specialising in cutting-edge fields such as chips, artificial intelligence and quantum technology, the South China Morning Post has learned. The government last week said that it received an “enthusiastic response” to the tender for four land parcels in the Hong Kong-Shenzhen Innovation and Technology Park…
Firms specializing in cutting-edge technology, such as chips, artificial intelligence, and quantum technology, have expressed strong interest in bidding for Hong Kong's flagship tech hub at the border with mainland China. The South China Morning Post reports that the government received six bids for four land parcels in the Hong Kong-Shenzhen Innovation and Technology Park (HSITP).
The combined gross floor area of the sites exceeds 76,000 square meters, and they are intended for laboratories and accommodation for talented individuals. The tender brief indicates that the winning bidder(s) will be entrusted with the design, construction, financing, and management of the sites, including the accommodation facilities.
The tender process, which initially had a year-end deadline, may be expedited to November. Successful bidders will need to provide a bank-backed, on-demand construction bond of HK$100 million as security for fulfilling their contractual obligations. The construction must be completed within 30 months of signing the sublease, with a target completion date of April 1, 2030.
The tender process aims to attract companies from various sectors, including scientific research and emerging tech firms, to showcase cross-border research capabilities and attract more advanced firms to Hong Kong.
Written by urgent.news from South China Morning Post - Hong Kong's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
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