NASA-linked, MIT-trained founders’ nSWX raises US$2M for AI chip packaging
The race to build larger AI models has created a less glamorous but increasingly urgent problem: how to move heat and power through ever-denser chip packages without driving up cost, energy use and complexity. A Malaysian startup now wants to solve part of that problem at the material boundary level. Kuala Lumpur-based nanoSkunkWorkX (nSWX) has […] The post NASA-linked, MIT-trained founders’ nSWX…
Kuala Lumpur-based startup nanoSkunkWorkX (nSWX) has secured US$2 million in seed funding from Singapore-based investor Tin Men Capital to develop advanced AI chip packaging solutions. The company, founded by former MIT computer scientist Iqbal Shamsul and NASA principal investigator Amani Salim, focuses on thin-film interfaces designed to improve heat and power management in AI hardware. nSWX's lead product, nSD-I, targets copper interconnects within chip packages, which face increasing demands for power and heat dissipation as devices become denser.
By enhancing the performance of copper interconnects without requiring new equipment or production line changes, nSWX aims to reduce AI infrastructure costs while maintaining high performance. The company's graphene-copper films have demonstrated superior heat transfer capabilities, with follow-up tests showing sustained advantages. nSWX's approach is crucial as AI infrastructure becomes more complex, and thermal efficiency gains are both commercially and technically significant.
The startup's founders have built nSWX with minimal external funding, leveraging their technical expertise and deep industry connections to create a viable solution for an increasingly challenging problem in AI chip development.
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