SK Hynix breaks ground for its $4B advanced memory chip packaging facility in Indiana, with mass production of next-generation HBM scheduled to begin in H2 2029 (Bloomberg)

SK Hynix has broken ground on a $4 billion advanced memory chip packaging facility in Indiana. The facility, located in West Lafayette, will specialize in the advanced packaging, testing, and research and development of high-bandwidth memory (HBM).

According to Tom's Hardware, mass production of next-generation HBM is scheduled to begin in the second half of 2029. The site is expected to employ around 1,000 people once commercial operations start. The cleanroom is set to be opened by October 2028.

The construction process has presented some unique challenges, as noted by Kim Hyun-jung, head of SK Hynix's construction team. He mentioned that the site has little bedrock, requiring more piles with greater diameters to be driven deeper into the ground, unlike their experience in Korea where foundation piles can be driven into solid bedrock.

The project is currently about 7% complete overall, with basic construction work at 15% complete. At its peak next year, the site is expected to have as many as 3,000 people working there each day.

Brief written by urgent.news from Techmeme, Tom's Hardware, The Hankyoreh, Hankyoreh — 4 reports on this story. Machine-written — may contain errors; check the original before relying on it.