SK hynix’s Indiana Fab Opens New Horizon for S. Korea-U.S. AI Chip Alliance
SK hynix held a historic groundbreaking ceremony for its next-generation High Bandwidth Memory (HBM) advanced packaging production base in West Lafayette, Indiana, the United States on Aug. 27 (local time), embarking on a journey to leap forward as the central pivot in the realignment of the global
SK hynix held a groundbreaking ceremony in West Lafayette, Indiana, on August 27, aiming to establish a central hub for the global AI semiconductor supply chain. This move transcends traditional economic and technological cooperation, signaling a fully integrated alliance between South Korea and the U.S. The $4 billion investment is set to commence in October 2028 and launch full-scale production of next-generation HBM in 2029.
SK hynix's approach combines 'South Korean wafers + US packaging,' with front-end processes in South Korea and back-end production in Indiana. This structure minimizes logistics time gaps and allows real-time customization to meet the demands of major tech companies like Nvidia and cloud enterprises. The project also involves a collaboration with Purdue University to create an advanced packaging R&D testbed, fostering innovation in chiplet and 3D packaging technologies. The project is expected to create over 7,000 jobs and strengthen national security.
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