SK hynix breaks ground on the first HBM plant in the US, bringing key AI component production to the States — says production starts in 2029
SK hynix breaks ground on HBM assembly plant in the U.S. that will form a connection between DRAM wafers produced in South Korea and their consumers among AI companies in the U.S.
High-bandwidth memory (HBM) is a crucial component in AI systems that has not been manufactured in the United States until now. SK hynix, the leading South Korean memory manufacturer, is set to break ground on its first HBM production plant in Indiana, bringing advanced packaging, testing, and research and development capabilities to the U.S. The facility, costing around $4 billion, is expected to commence operations in the second half of 2029, a year later than initially planned.
SK hynix will utilize DRAM wafers and base dies produced in South Korea and Taiwan, packaging them into the HBM stacks at the Indiana site. The company expects this facility to employ about 1,000 workers once commercial production begins. This move to establish a U.S.-based HBM production hub is seen as a significant step towards strengthening the country's position in AI innovation, enabling SK hynix and its customers to reduce feedback loops and accelerate the development of customized HBM-class memory.
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