(LEAD) SK hynix holds groundbreaking ceremony for HBM production base in U.S.

SK hynix, the South Korean chipmaker, recently held a groundbreaking ceremony for an advanced packaging production facility for AI memory in Indiana, USA. The facility, which is expected to produce hundreds of thousands of wafers annually, is set to become the first next-generation High Bandwidth Memory (HBM) production hub in the United States.

With an estimated investment of over US$4 billion, the Indiana fab will open its cleanroom by October 2028 and begin mass production of next-generation HBM in the second half of 2029. SK hynix plans to deliver cutting-edge wafers produced in South Korea to Indiana for advanced packaging and testing before supplying made-in-U.S.A. products to American big-tech companies like Nvidia.

The facility will also feature an advanced packaging research and development testbed, enabling collaboration between customers, universities, and business partners to develop packaging technologies.

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