SK Hynix to start AI chip volume production in Indiana in 2029
SK Hynix, a South Korean chipmaker, announced plans to commence volume production of its next-generation HBM4E chips at a facility in Indiana, U.S., in the third quarter of 2029. The project, valued at over $4 billion, signifies a significant growth for SK Hynix's U.S. operations amidst a persistent memory chip shortage. The chief executive, Kwak Noh-Jung, anticipates the site to achieve annual capacity of hundreds of thousands of wafers.
The expansion aligns with the escalating demand for high-bandwidth memory, driven by the AI boom. SK Hynix aims to establish a robust HBM production base in the U.S., with the facility currently scheduled to commence cleanroom operations by the second half of 2028. The site will house an HBM packaging line, an AI semiconductor R&D facility, and contribute to the creation of around 7,000 jobs.
The U.S. government has allocated $458 million in grants and up to $500 million in loans under the CHIPS Act to support the project.
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