SK Hynix to start AI chip volume production in Indiana in 2029
WEST LAFAYETTE, Indiana — South Korean chipmaker SK Hynix said on Thursday it plans to begin volume production of its next-generation HBM4E chips at its Indiana facility in the third quarter of 2029, and expects the site to eventually reach annual capacity of hundreds of thousands of wafers. The more than $4 billion project marks a major expansion of SK Hynix's U.S. operations as surging…
WEST LAFAYETTE, Indiana - South Korean chip manufacturer SK Hynix announced on Thursday its intention to commence volume production of its upcoming HBM4E chips at its Indiana facility during the third quarter of 2029. The company anticipates this new site to eventually attain an annual capacity of hundreds of thousands of wafers.
This ambitious $4 billion endeavor represents a significant expansion of SK Hynix's U.S. operations, driven by the escalating investment in artificial intelligence and the increasing demand for high-bandwidth memory (HBM). The chipmaker aims to bring production closer to key clients like Nvidia, Microsoft, and Alphabet's Google.
By 2030, SK Hynix projects Indiana will become a crucial HBM production hub in the United States. The facility, located at the Purdue Research Park in West Lafayette, is set to initiate cleanroom operations in the second half of 2028. The cleanroom will provide a highly controlled manufacturing environment, free from dust and other microscopic contaminants during the delicate chipmaking process.
The site will accommodate a next-generation HBM packaging line, along with an AI semiconductor research and development center.
Written by urgent.news from The Korea Times's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
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