SK Hynix to start AI chip volume production in Indiana in 2029
WEST LAFAYETTE, Indiana — South Korean chipmaker SK Hynix said on Thursday it plans to begin volume production of its next-generation HBM4E chips at its Indiana facility in the third quarter of 2029, and expects the site to eventually reach annual capacity of hundreds of thousands of wafers. The more than $4 billion project marks a major expansion of SK Hynix's U.S. operations as surging…
WEST LAFAYETTE, Indiana - South Korean semiconductor giant SK Hynix announced on Thursday that it intends to commence volume production of its upcoming HBM4E chips at its Indiana plant in the third quarter of 2029. The company anticipates the facility to eventually achieve an annual capacity of hundreds of thousands of wafers. This significant expansion of SK Hynix's U.S. operations comes as the demand for high-bandwidth memory, or HBM, surges due to the escalating investment in artificial intelligence.
The primary objective is to position production nearer to crucial customers such as Nvidia, Microsoft, and Alphabet's Google. By 2030, SK Hynix projects that Indiana will become a pivotal HBM production hub within the United States. The facility, located at the Purdue Research Park in West Lafayette, is set to commence cleanroom operations in the second half of 2028.
Chief Executive Officer Kwak Noh-Jung stated this. The site will be equipped with a next-generation HBM packaging line as well as an AI semiconductor research and development area.
Written by urgent.news from The Korea Times's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
This story
This is one outlet's version. Read the fullest account.
- SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility channelnewsasia.com
- SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility investing.com
- SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility economictimes.indiatimes.com
- SK Hynix to start US AI chip output in 2029, sees memory shortage through 2030 koreatimes.co.kr
- SK Hynix broke ground on its first U.S. AI chip packaging plant in Indiana qz.com
- SK Hynix CEO says Indiana will be key memory production base by 2030, first U.S. facility now underway cnbc.com
- SK Hynix CEO dismisses memory chip oversupply risks, sees crunch till end of 2030 asia.nikkei.com
