SK hynix Breaks Ground on $3.87 Billion U.S. HBM Plant
On Aug. 27, SK hynix officially broke ground on an advanced packaging facility for high-bandwidth memory (HBM) used in artificial intelligence in West Lafayette, Indiana, marking the start of full-scale construction. The $3.87 billion investment will give SK hynix its first HBM production base in th
SK hynix has officially begun construction on a $3.87 billion advanced packaging facility for high-bandwidth memory (HBM) in West Lafayette, Indiana, marking its first HBM production base in the United States. The investment aims to strengthen the company's position in the global AI memory market, with the facility expected to create around 7,000 jobs.
Infrastructure support, including infrastructure for energy, industrial gases, and water, is being developed with the help of local governments and utility companies. The U.S. government has pledged up to $958 million in grants and loans under the CHIPS and Science Act, while Indiana has offered up to $712 million in tax incentives.
The 540,000-square-meter site is projected to begin mass production of HBM and other AI memory products in the second half of 2028.
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