Xiaomi Officially Announces Xring O3 Chipset; To Debut On The Xiaomi 18 Fold

Xiaomi has introduced its newest flagship chipset, the Xring O3, in China. The company announced the chip's debut alongside the launch of the Xiaomi 18 Fold, a foldable smartphone set to release in September. The Xring O3 is positioned as a top-tier SoC to compete with Qualcomm and MediaTek. TSMC is manufacturing the chip, which is reportedly codenamed "Lhasa."

The Xring O3 features a new architecture with a highly optimized three-cluster CPU layout, and it is expected to reach up to 4.05GHz with its Titanium performance cores and 3.02GHz efficiency cores. The GPU's clock speed is also expected to increase from 1.2GHz to around 1.5GHz. The chipset supports LPDDR6 memory, delivering speeds up to 10,667Mbps with a bandwidth of 113.8GB/s.

It has a die size of 133mm² and contains more than 24 billion transistors. The Xring O3 also brings enhancements to its AI and processing capabilities, including an NPU delivering up to 200 TOPS of tensor performance and 3.13 TFLOPS of vector performance. Xiaomi claims that the chip delivers a 45% increase in AI performance compared to its predecessor.