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Broadcom seeks more than US$60 billion in latest AI debt deal

The company plays a crucial role in helping design custom chips for firms like Alphabet and Meta

Broadcom is in discussions with a group of lenders to raise over US$60 billion in debt for an AI chip financing deal, according to Bloomberg News on Thursday. The financing could include a US$30 billion junior debt tranche and a senior-secured tranche ranging from US$60 billion to US$70 billion, potentially totaling up to US$100 billion.

Broadcom, which helps design custom chips for tech giants like Alphabet and Meta, is also a chip supply partner for Anthropic and OpenAI. Blackstone and Apollo Global Management are among those in talks with Broadcom to participate in the financing. The new debt would be issued by a special-purpose vehicle, similar to the previously announced US$35 billion agreement for Anthropic's expansion.

Tech companies are increasingly turning to debt markets to fund their AI investments, with hyperscalers like Alphabet, Amazon, and Microsoft signaling continued AI spending through 2026.

Written by urgent.news from The Business Times - Companies & Markets's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.

Read the original at businesstimes.com.sg →

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