HBM Boom Raises Commodity Memory Risks
The memory semiconductor market is entering a new phase in which the High Bandwidth Memory (HBM) boom driven by artificial intelligence (AI) demand and concerns over supply pressure in commodity DRAM and NAND are surfacing simultaneously.The shared view among brokerage analysts is that expanding AI
The memory semiconductor industry is experiencing a transformative period, marked by the rapid growth of the High Bandwidth Memory (HBM) market driven by artificial intelligence (AI) demands and supply constraints in commodity DRAM and NAND. Analysts anticipate that AI infrastructure investments will propel HBM demand to reach 53.4 billion Gb in 2027, a 56% increase from the previous year, despite a projected 50% growth in supply.
Rapid production capacity expansion is underway, yet actual supply levels are influenced by stacking yield, advanced packaging, and generational transitions. Export data reveals a 287% year-on-year surge in memory semiconductor exports in July, with DRAM exports up 493% and NAND exports down 32%. However, the strength of HBM and server memory demand is not evenly distributed across all memory product categories, as evident from a decline in overall memory export value by approximately 8%.
Long-term supply agreements (LTAs) and their impact are uncertain, with concerns that equipment investments tied to contracted volumes could spur commodity memory supply growth over time. The rising cost of memory in end-product manufacturing, particularly smartphones and notebook PCs, indicates potential challenges in passing price increases to finished products.
The emergence of Chinese memory makers, including Yangtze Memory Technologies Co. (YMTC) and Changxin Memory Technologies (CXMT), adds another layer of complexity. While Korean manufacturers maintain a technological edge in HBM, the expansion of Chinese manufacturers in commodity memory could intensify price competition and affect profitability.
The industry's outlook hinges on key factors such as HBM4 contract prices and shipment volumes, DDR5 spot and contract price spreads, DRAM and NAND inventory levels, smartphone and PC shipment figures, Chinese manufacturers' wafer input, and the pace of capital expenditure execution by market leaders Samsung Electronics and SK Hynix.
If HBM shipments grow and inventory remains stable, a longer and less volatile market cycle may develop. Conversely, a slowdown in consumer demand and simultaneous supply expansion from China could reignite concerns about a commodity memory peak-out. The memory market's current fragmentation, with distinct segments for HBM and server memory on one hand, and PC and smartphone memory on the other, is set to shape the next cycle for industry leaders.
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