University of Seoul student team wins grand prize at Simulation Challenge 2026
A University of Seoul student team won the grand prize at Simulation Challenge 2026, held at Yeoksam POSCO Tower in southern Seoul on July 30. The Simulation Challenge was an academic competition organized by Synopsys Korea’s Simulation & Analysis Division and co-hosted by Tae Sung S&E. Participating teams used simulation software to propose solutions to technical industry challenges and…
The University of Seoul's student team, Save the World with Hybrid Bonding, secured the grand prize at the Simulation Challenge 2026, an academic competition held at Yeoksam POSCO Tower in southern Seoul on July 30. Organized by Synopsys Korea’s Simulation & Analysis Division and co-hosted by Tae Sung S&E, the event tasked participating teams with using simulation software to address technical industry challenges and showcase the viability of their designs.
The University of Seoul's Advanced Packaging Lab team, led by Professor Park Ah-young and consisting of materials science and engineering majors Choi Seung-uk, Jang Sun-woong, and chemical engineering major Kim Kwon-hee, presented their research titled “Design of a Radial Collet Bonding Tool for Reducing Voids in the Hybrid Bonding Process.”
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