University of Seoul student team wins grand prize at Simulation Challenge 2026
A University of Seoul student team won the grand prize at Simulation Challenge 2026, held at Yeoksam POSCO Tower in southern Seoul on July 30. The Simulation Challenge was an academic competition organized by Synopsys Korea’s Simulation & Analysis Division and co-hosted by Tae Sung S&E. Participating teams used simulation software to propose solutions to technical industry challenges and…
The University of Seoul's Save the World with Hybrid Bonding team emerged victorious at the Simulation Challenge 2026, held at Yeoksam POSCO Tower in southern Seoul on July 30. The annual academic competition, organized by Synopsys Korea's Simulation & Analysis Division in collaboration with Tae Sung S&E, challenged participating teams to devise solutions using simulation software for technical industry problems and exhibit the viability of their designs.
The undergraduate division winner, Park Ah-young's team from the Advanced Packaging Lab, comprised materials science and engineering majors Choi Seung-uk and Jang Sun-woong, along with chemical engineering major Kim Kwon-hee. They showcased their research, "Design of a Radial Collet Bonding Tool for Reducing Voids in the Hybrid Bonding Process," which focused on a novel approach to hydraulic bonding technology.
This innovation aims to enhance the direct bonding of copper pads and dielectric layers, ultimately reducing voids in the hybrid bonding process.
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