Beyond lithography: Chinese chip toolmaker achieves wafer polishing breakthrough

Chinese chip-tool manufacturer Hwatsing Technology has made a significant advancement in wafer polishing, a crucial stage in semiconductor manufacturing. This breakthrough, announced on Thursday, involves the development of a new metrology system specifically designed for six-inch wafers. The system aims to detect defects and maintain manufacturing consistency, marking the first time a six-inch metrology system has been integrated directly with chemical mechanical polishing equipment in China.

Wafer polishing is a complex process that transforms raw silicon discs into finished chips. It includes coating the wafer with photoresist, etching intricate layers, and creating microscopic transistors. The new measurement tool can be seamlessly integrated into the polishing workflow, allowing for real-time measurements before and after the polishing process.

This integration provides live data to the control system, which can enhance wafer uniformity, reduce waste, and address inefficiencies in traditional production lines.

Located in Tianjin, Hwatsing Technology reported that the new system has already been delivered to an unnamed major domestic producer of optical silicon materials. The system is targeted towards chips used in power devices, microelectromechanical systems, and sensors, which are predominantly based on mature processing nodes. These components are extensively utilized in electric vehicles, industrial equipment, consumer electronics, and telecommunications infrastructure.

According to a May report by brokerage firm Bernstein, domestic suppliers hold a 21% share of China’s overall wafer-fabrication equipment market, while domestic wafer polishers account for 39% of this market. Among domestic players, Hwatsing Technology leads with 85% of the market share, up from 1% in 2018. The company’s global share increased to 37% last year, compared to 1% in 2018.

However, despite a 63% revenue increase for domestic manufacturers in the past year, the self-sufficiency rate for wafer metrology and inspection tools remains low at just 10%. This situation underscores the ongoing dependence on foreign suppliers for more complex manufacturing procedures, particularly in lithography. Lithography, a strategic chipmaking technology dominated by the Dutch company ASML, is currently barred from exporting its most advanced deep-ultraviolet lithography systems and extreme-ultraviolet machines to China.

The report by Bernstein suggests that there are "virtually no viable local alternatives" and "zero meaningful progress" in substituting the foreign technology.