Sandisk and SK Hynix announce the High Bandwidth Flash (HBF) open specification that enables up to 512GB memory modules with 0.4 TB/s to 3.0 TB/s bandwidth (Anton Shilov/Tom's Hardware)
The specification is here, but what about the interest? … The specification was released through the Open Compute Project (OCP) …
Sandisk and SK Hynix have announced the High Bandwidth Flash (HBF) open specification, which enables memory modules with capacities of up to 512GB and bandwidth ranging from 0.4 TB/s to 3.0 TB/s. The specification was released through the Open Compute Project.
The HBF specification supports capacities of up to 512GB using 8-high and 16-high NAND stacks. According to Slashdot, it also uses the UCIe chiplet interface, which could make HBF easier to integrate with CPUs, GPUs, and other accelerators.
Google and Tenstorrent participated in the standardization effort. However, commercial products and independent benchmarks are still missing.
Brief written by urgent.news from Techmeme, Tom's Hardware, Slashdot — 3 reports on this story. Machine-written — it may contain errors, so check the original before relying on it.
