{
  "id": 8779775,
  "title": "ASML (ASML) and Chip Giants like TSMC Plot a Bigger Canvas for Building AI Chips",
  "url": "https://urgent.news/2026/09/20/asml-asml-and-chip-giants-like-tsmc-plot-a-bigger-canvas-for-building",
  "topic": "tech",
  "section": "Tech",
  "published": "2026-09-20T21:41:29.000Z",
  "source": {
    "name": "Yahoo Finance",
    "slug": "yahoo-finance",
    "url": "https://finance.yahoo.com/technology/ai/articles/asml-asml-chip-giants-tsmc-214129428.html"
  },
  "original_language": "en",
  "account": "On September 8th, 2026, Reuters announced that ASML Holding N.V. (NASDAQ:ASML) intends to collaborate with industry giants including Taiwan Semiconductor Manufacturing Company (NYSE:TSM), Nvidia, Intel, Samsung, and SK Hynix. The partnership aims to modify ASML's upcoming extreme ultraviolet lithography tools for manufacturing larger data-center chips. This initiative aims to overcome the current constraint of smaller masks used in newer machines compared to ASML's standard EUV tools. ASML's goal is to commence pilot production by 2031 and achieve high-volume manufacturing readiness by 2033.\n\nThe project's chief technology officer, Marco Pieters, estimates a potential productivity increase of around 40% for these systems. This development could generate a fresh growth prospect for ASML, while simultaneously assisting TSMC in producing larger AI chips more efficiently. ASML plans to utilize its High NA EUV tools to process chips as substantial as the current largest data-center processors.\n\nThe company anticipates that the larger masks will augment system productivity by approximately 40%, potentially driving up demand for their next-generation equipment and aiding TSMC's economic viability in producing increasingly complex chips. TSMC has pledged to incorporate High NA EUV into high-volume production from 2030. ASML intends to demonstrate the larger-mask technology through a pilot line in 2031.\n\nThis collaboration could enhance both companies' standing as manufacturers of larger and more powerful processors. ASML can broaden its High NA roadmap past its present chip-size restriction. TSMC can prepare its manufacturing procedures for the forthcoming generation of AI chips. The partnership offers ASML an opportunity to strengthen its relationship with one of its most significant customers and provides TSMC access to a technology that could facilitate forthcoming advanced-chip production. Nevertheless, the larger-chip opportunity is years away from impacting either company's financial results. TSMC targets high-volume High NA production to commence in 2030, while ASML plans to initiate a larger-mask pilot line in 2031 and high-volume production in 2033. Investors should not anticipate the new initiative to spur near-term revenue for either company. The transition to larger masks could pose execution risks for both ASML and TSMC. ASML must develop and validate larger masks for its High NA systems, while TSMC must integrate the technology into high-volume manufacturing. Any delays or technical issues could delay the productivity gains and revenue opportunities that the companies foresee from the new technology. TSMC and ASML must still validate that the productivity gains justify the industry's transition costs. The larger-mask approach necessitates changes beyond ASML's lithography tools, encompassing new mask infrastructure and production processes. If chipmakers determine that the expenses of adopting the technology exceed the anticipated productivity benefits, ASML might encounter slower High NA adoption, while TSMC might postpone its planned rollout.",
  "summary": "ASML Holding N.V. (NASDAQ:ASML) has announced plans to collaborate with major chipmakers, including Taiwan Semiconductor Manufacturing Company (NYSE:TSM), Nvidia, Intel, Samsung, and SK Hynix, to develop its next-generation High NA extreme ultraviolet lithography tools. These tools will be capable of printing larger data-center chips, addressing the current limitation of using smaller masks with ASML's standard EUV tools. The company aims to pilot a production line using larger masks by 2031 and achieve high-volume manufacturing readiness by 2033, which could potentially increase the productivity of these systems by approximately 40%. This collaboration could create new growth opportunities for ASML while helping TSMC manufacture larger AI chips more efficiently.",
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 1,
    "also_reported_by": []
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}