{
  "id": 7982591,
  "title": "Huawei speeds up launch of new AI chip to take on Nvidia",
  "url": "https://urgent.news/2026/09/17/huawei-speeds-up-launch-of-new-ai-chip-to-take-on-nvidia",
  "topic": "ai",
  "section": "AI",
  "published": "2026-09-17T08:19:00.000Z",
  "source": {
    "name": "Straits Times Business",
    "slug": "straits-times-business",
    "url": "https://www.straitstimes.com/business/huawei-speeds-up-launch-of-new-ai-chip-to-take-on-nvidia"
  },
  "original_language": "en",
  "account": "Huawei is hastening the release of its upcoming AI chip, the Ascend 960DT, to early 2027, intending to challenge Nvidia in the Chinese market and the global arena. Huawei's senior executive Wang Tao disclosed this at the company's annual summit in Shanghai on September 17. The company's director has also announced the release of 960PR variant in the third quarter of 2027. This accelerated timeline demonstrates Huawei's growing confidence in its three-year semiconductor strategy to eventually replace Nvidia. The company, instrumental in China's bid to rival the US in AI, has been openly discussing its plans to create more potent hardware for data centers since 2025. Wang also emphasized Huawei's intention to present AI chips as a substitute to US-origin semiconductors. \"Computing power is crucial to Huawei's overall AI strategy,\" stated Wang. \"We aim to enhance China's computing power foundation and offer a new option for the world with our SuperPod technology.\" SuperPod technology allows up to 100,000 Ascend chips to operate in a single cluster, enhancing data transmission through Huawei's UnifiedBus networking protocol. The Chinese company asserts that its adaptations and networking can compensate for the single-chip performance limitations compared to competitors like Nvidia.",
  "summary": "The two versions of the Ascend 960 will be in the market in the first and third quarters of 2027.",
  "key_points": [
    "Huawei plans to launch Ascend 960DT AI chip in early 2027.",
    "Ascend 960PR variant to follow in Q3 2027.",
    "Huawei aims to challenge Nvidia with SuperPod technology."
  ],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 1,
    "also_reported_by": []
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}