{
  "id": 7345924,
  "title": "Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP",
  "url": "https://urgent.news/2026/09/14/lorentz-solution-jointly-presents-with-nvidia-on-automated-large",
  "topic": "tech",
  "section": "Tech",
  "published": "2026-09-14T15:32:06.000Z",
  "source": {
    "name": "Financial Post",
    "slug": "financial-post",
    "url": "https://financialpost.com/pmn/business-wire-news-releases-pmn/lorentz-solution-jointly-presents-with-nvidia-on-automated-large-scale-chip-level-3d-em-extraction-and-sign-off-of-ultra-high-speed-silicon-photonics-and-ic-3dic-designs-at-2026-tsmc-oip"
  },
  "original_language": "en",
  "account": null,
  "summary": "PeakView®‘s automated xLEM™ flow extends Lorentz’s 3D EM leadership from design to full-chip EM sign-off, delivering complete, LVS-clean electromagnetic verification for today’s and next-generation ultra-high-speed AI, photonics and IC/3DIC designs SANTA CLARA, Calif. — Lorentz Solution, Inc., the world’s leading provider of 3D electromagnetic (EM) design platforms for IC, 3DIC, and advanced…",
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 1,
    "also_reported_by": []
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}