{
  "id": 6251543,
  "title": "Samsung, ASML expand partnership to introduce next-gen lithography by 2028",
  "url": "https://urgent.news/2026/09/08/samsung-asml-expand-partnership-to-introduce-next-gen-lithography-by-6251543",
  "topic": "tech",
  "section": "Tech",
  "published": "2026-09-08T07:42:03.000Z",
  "source": {
    "name": "The Korea Times",
    "slug": "the-korea-times-koreatimes",
    "url": "https://www.koreatimes.co.kr/business/companies/20260908/samsung-asml-expand-partnership-to-introduce-next-gen-lithography-by-2028"
  },
  "original_language": "en",
  "account": "Samsung Electronics and ASML, the leading semiconductor equipment manufacturer, have announced plans to bolster their collaboration on advanced high numerical aperture (High NA) extreme ultraviolet (EUV) lithography technology. The companies aim to integrate this cutting-edge technology into Samsung's Dynamic Random Access Memory (DRAM) manufacturing processes by 2028, marking a significant milestone in the industry.\n\nUnder the terms of their renewed partnership, Samsung and ASML will collaborate to expedite the development and implementation of technologies that will enable the production of ever-finer circuit patterns. These patterns are crucial for advancing semiconductor performance and efficiency.\n\nEUV lithography plays a pivotal role in this process. The technology projects intricate circuit designs onto a silicon wafer using light, with the circuit pattern initially formed on a photomask. The EUV light then reflects off the mask, and an optical system reduces and projects the image onto the wafer. Increasing the numerical aperture (NA) of the optical system is one method to achieve finer circuit patterns as semiconductor technology continues to evolve.\n\nThis expanded partnership signifies Samsung's commitment to driving innovation in the semiconductor sector. By integrating ASML's High NA EUV lithography into their DRAM mass production by 2028, the companies aim to set new industry standards and meet the demanding performance and efficiency requirements of advanced semiconductor manufacturing.",
  "summary": "Samsung Electronics and semiconductor equipment giant ASML announced Tuesday that they will expand their strategic partnership on High NA extreme ultraviolet (EUV) lithography, with Samsung planning to introduce the technology into DRAM mass production by 2028 for the first time in the industry. The two companies said they will work together to accelerate the development and deployment of…",
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 4,
    "also_reported_by": [
      {
        "outlet": "Yonhap News",
        "title": "Samsung, ASML team up on next-generation semiconductor manufacturing technology",
        "url": "https://urgent.news/2026/09/08/samsung-asml-team-up-on-next-generation-semiconductor-manufacturing",
        "published": "2026-09-08T06:47:51.000Z"
      },
      {
        "outlet": "The Korea Times",
        "title": "Samsung, ASML expand partnership to introduce next-gen lithography by 2028",
        "url": "https://urgent.news/2026/09/08/samsung-asml-expand-partnership-to-introduce-next-gen-lithography-by",
        "published": "2026-09-08T07:27:02.000Z"
      },
      {
        "outlet": "Tech in Asia",
        "title": "ASML draws Samsung, TSMC to next-gen EUV machines",
        "url": "https://urgent.news/2026/09/08/asml-draws-samsung-tsmc-to-next-gen-euv-machines",
        "published": "2026-09-08T23:54:59.000Z"
      }
    ]
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}