{
  "id": 341534,
  "title": "University of Seoul student team wins grand prize at Simulation Challenge 2026",
  "url": "https://urgent.news/2026/08/09/university-of-seoul-student-team-wins-grand-prize-at-simulation-341534",
  "topic": "culture",
  "section": "Culture",
  "published": "2026-08-09T04:02:03.000Z",
  "source": {
    "name": "The Korea Times",
    "slug": "the-korea-times-koreatimes",
    "url": "https://www.koreatimes.co.kr/southkorea/education/20260809/university-of-seoul-student-team-wins-grand-prize-at-simulation-challenge-2026"
  },
  "original_language": "en",
  "account": "The University of Seoul's student team, \"Save the World with Hybrid Bonding,\" emerged victorious at the Simulation Challenge 2026, held at Yeoksam POSCO Tower in southern Seoul on July 30. Organized by Synopsys Korea’s Simulation & Analysis Division in collaboration with Tae Sung S&E, the competition challenged academic teams to propose feasible solutions to technical industry problems using simulation software. The university revealed that the undergraduate division's top prize was awarded to the team from the Advanced Packaging Lab. Guided by Professor Park Ah-young from the Department of Materials Science and Engineering, the winning team comprised materials science and engineering majors Choi Seung-uk and Jang Sun-woong, along with chemical engineering major Kim Kwon-hee. Their winning research, titled \"Design of a Radial Collet Bonding Tool for Reducing Voids in the Hybrid Bonding Process,\" focused on a technology that directly bonds copper pads and dielectric layers in hybrid bonding.",
  "summary": "The University of Seoul's student team, Save the World with Hybrid Bonding, secured the grand prize at the Simulation Challenge 2026, held at Yeoksam POSCO Tower in southern Seoul on July 30. Organized by Synopsys Korea’s Simulation & Analysis Division and co-hosted by Tae Sung S&E, the competition tasked participating teams with utilizing simulation software to propose solutions for technical industry challenges. The university's Advanced Packaging Lab team, led by Professor Park Ah-young, emerged victorious in the undergraduate division. Consisting of materials science and engineering majors Choi Seung-uk, Jang Sun-woong, and chemical engineering major Kim Kwon-hee, the team showcased their research titled \"Design of a Radial Collet Bonding Tool for Reducing Voids in the Hybrid Bonding Process,\" which focused on improving the efficiency of hybrid bonding technology.",
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 2,
    "also_reported_by": [
      {
        "outlet": "The Korea Times",
        "title": "University of Seoul student team wins grand prize at Simulation Challenge 2026",
        "url": "https://urgent.news/2026/08/09/university-of-seoul-student-team-wins-grand-prize-at-simulation",
        "published": "2026-08-09T03:47:02.000Z"
      }
    ]
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}