{
  "id": 340746,
  "title": "University of Seoul student team wins grand prize at Simulation Challenge 2026",
  "url": "https://urgent.news/2026/08/09/university-of-seoul-student-team-wins-grand-prize-at-simulation",
  "topic": "finance",
  "section": "Finance & Markets",
  "published": "2026-08-09T03:47:02.000Z",
  "source": {
    "name": "The Korea Times",
    "slug": "the-korea-times",
    "url": "https://www.koreatimes.co.kr/southkorea/education/20260809/university-of-seoul-student-team-wins-grand-prize-at-simulation-challenge-2026"
  },
  "original_language": "en",
  "account": "The University of Seoul's Save the World with Hybrid Bonding team emerged victorious at the Simulation Challenge 2026, held at Yeoksam POSCO Tower in southern Seoul on July 30. The annual academic competition, organized by Synopsys Korea's Simulation & Analysis Division in collaboration with Tae Sung S&E, challenged participating teams to devise solutions using simulation software for technical industry problems and exhibit the viability of their designs.\n\nThe undergraduate division winner, Park Ah-young's team from the Advanced Packaging Lab, comprised materials science and engineering majors Choi Seung-uk and Jang Sun-woong, along with chemical engineering major Kim Kwon-hee. They showcased their research, \"Design of a Radial Collet Bonding Tool for Reducing Voids in the Hybrid Bonding Process,\" which focused on a novel approach to hydraulic bonding technology. This innovation aims to enhance the direct bonding of copper pads and dielectric layers, ultimately reducing voids in the hybrid bonding process.",
  "summary": "The University of Seoul's student team, Save the World with Hybrid Bonding, secured the grand prize at the Simulation Challenge 2026, an academic competition held at Yeoksam POSCO Tower in southern Seoul on July 30. Organized by Synopsys Korea’s Simulation & Analysis Division and co-hosted by Tae Sung S&E, the event tasked participating teams with using simulation software to address technical industry challenges and showcase the viability of their designs. The University of Seoul's Advanced Packaging Lab team, led by Professor Park Ah-young and consisting of materials science and engineering majors Choi Seung-uk, Jang Sun-woong, and chemical engineering major Kim Kwon-hee, presented their research titled “Design of a Radial Collet Bonding Tool for Reducing Voids in the Hybrid Bonding Process.”",
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 2,
    "also_reported_by": [
      {
        "outlet": "The Korea Times",
        "title": "University of Seoul student team wins grand prize at Simulation Challenge 2026",
        "url": "https://urgent.news/2026/08/09/university-of-seoul-student-team-wins-grand-prize-at-simulation-341534",
        "published": "2026-08-09T04:02:03.000Z"
      }
    ]
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}