{
  "id": 3246344,
  "title": "Xiaomi 18 Fold Launching in September With Record-Breaking Xring O3 Chip",
  "url": "https://urgent.news/2026/08/25/xiaomi-18-fold-launching-in-september-with-record-breaking-xring-o3",
  "topic": "tech",
  "section": "Tech",
  "published": "2026-08-25T10:58:02.000Z",
  "source": {
    "name": "ProPakistani",
    "slug": "propakistani",
    "url": "https://propakistani.pk/2026/08/25/xiaomi-18-fold-launching-in-september-with-record-breaking-xring-o3-chip/"
  },
  "original_language": "en",
  "account": "Xiaomi has announced its upcoming foldable smartphone, the Xiaomi 18 Fold, set to release in September 2026. This new device will be the first to feature Xiaomi's second-generation Xring O3 chipset. President Lu Weibing has already begun using the phone publicly, and pre-reservations are now available in China.\n\nThe Xring O3 chipset has achieved a remarkable score of 5,228,014 points on AnTuTu V11, becoming the first mobile flagship chip to surpass the five-million-point threshold. Manufactured using a 3nm process, the chip contains approximately 24 billion transistors, an increase from the 19 billion transistors on the previous Xring O1. It boasts a 10-core CPU, with the C1-Ultra cores running at up to 4.35GHz, four C1-Premium cores at 3.68GHz, and four C1-Pro cores at up to 3.15GHz. In Geekbench 6, Xiaomi reports a 15,221 multi-core score, indicating a 60% improvement over the previous generation. Single-core performance reaches around 3,945 points.\n\nThe Xring O3 also introduces significant upgrades in graphics and AI performance. Its 16-core G2-Ultra NX GPU delivers up to 85% better conventional GPU performance and up to 182% better ray-tracing performance compared to the Xring O1. Power consumption can be decreased by 64% when handling equivalent performance. Additionally, the chipset becomes the first mobile processor to support LPDDR6 memory, offering bandwidth up to 113.8GB/s, which is 48% higher than its predecessor.\n\nMoreover, the redesigned Neuro Processing Unit (NPU) in the Xring O3 provides up to 200 TOPS of tensor computing performance, optimized for Xiaomi's MiMo on-device AI models. Overall on-device AI performance has improved by 45%. Complete specifications, pricing, and availability for the Xiaomi 18 Fold will be unveiled as the launch date approaches.",
  "summary": "Xiaomi has officially confirmed that its next foldable smartphone will be called the Xiaomi 18 Fold, rather than the previously … Read More The post Xiaomi 18 Fold Launching in September With Record-Breaking Xring O3 Chip appeared first on ProPakistani .",
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 1,
    "also_reported_by": []
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}