{
  "id": 3142407,
  "title": "AMD Is Investing More Than $10 Billion in Taiwan to Build Advanced Chip Packaging With TSMC. Here's What Lisa Su Is Actually Buying With That Money.",
  "url": "https://urgent.news/2026/08/23/amd-is-investing-more-than-10-billion-in-taiwan-to-build-advanced-3142407",
  "topic": "tech",
  "section": "Tech",
  "published": "2026-08-23T15:50:00.000Z",
  "source": {
    "name": "Yahoo Finance",
    "slug": "yahoo-finance",
    "url": "https://finance.yahoo.com/technology/articles/amd-investing-more-10-billion-155000045.html"
  },
  "original_language": "en",
  "account": "Advanced Micro Devices (AMD) is set to invest more than $10 billion in Taiwan over the next seven years. This investment aims to bolster the semiconductor ecosystem in Taiwan, encompassing advanced packaging, chip substrates, and manufacturing capacity for AI systems. CEO Lisa Su's strategy is centered on ensuring AMD can manufacture sufficient AI hardware to meet the growing demand. Currently, AMD's Venus EPYC server CPU is undergoing production using TSMC's 2-nanometer process technology, and the company is also utilizing TSMC's SoIC-X and CoWoS-L advanced packaging technologies for certain AI and data center chips. Beyond TSMC, AMD is exploring partnerships with other Taiwanese suppliers, such as ASE Technology and Siliconware Precision Industries, to develop innovative chip packaging solutions like the Elevated Fanout Bridge (EFB) technology. The company is also testing a panel-based version of this packaging technology with Powertech Technology. These investments are crucial, as TSMC's CEO C.C. Wei has highlighted that limited advanced-packaging capacity could hinder customers' growth. In the second quarter, AMD's Data Center revenue surged by 107% year-over-year to $6.7 billion, representing approximately 58% of the company's total revenue. Management forecasts that Data Center revenue will grow at a compound annual growth rate (CAGR) of over 60% over the next three to five years, with AI-related growth expected to exceed 80%. To achieve these ambitious growth targets, AMD requires a significantly expanded supply chain. For instance, a Helios AI rack houses 72 Instinct MI455X GPUs and 18 Venice CPUs. While AMD has allocated $1.2 billion to property and equipment during the first half of 2026, the company has secured $30.3 billion in unconditional commitments, primarily covering wafers, substrates, components, cloud capacity, software, and technology licenses. Nevertheless, AMD has yet to invest in chip manufacturing factories. The company's non-GAAP operating margin stands at 27% in the second quarter, falling short of the management's target of exceeding 35% over the next three to five years.",
  "summary": null,
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 3,
    "also_reported_by": [
      {
        "outlet": "Motley Fool",
        "title": "AMD Is Investing More Than $10 Billion in Taiwan to Build Advanced Chip Packaging With TSMC. Here's What Lisa Su Is Actually Buying With That Money.",
        "url": "https://urgent.news/2026/08/23/amd-is-investing-more-than-10-billion-in-taiwan-to-build-advanced",
        "published": "2026-08-23T15:30:00.000Z"
      },
      {
        "outlet": "Nasdaq Markets",
        "title": "AMD Is Investing More Than $10 Billion in Taiwan to Build Advanced Chip Packaging With TSMC. Here's What Lisa Su Is Actually Buying With That Money.",
        "url": "https://urgent.news/2026/08/23/amd-is-investing-more-than-10-billion-in-taiwan-to-build-advanced-2827317",
        "published": "2026-08-23T15:50:00.000Z"
      }
    ]
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}