{
  "id": 19738922,
  "title": "Lee Jae-yong Pledges 46 Trillion Won Investment to Transform Onyang Campus into HBM Hub",
  "url": "https://urgent.news/2026/11/13/lee-jae-yong-pledges-46-trillion-won-investment-to-transform-onyang",
  "topic": "tech",
  "section": "Tech",
  "published": "2026-11-13T01:46:51.000Z",
  "source": {
    "name": "Korea IT Times",
    "slug": "korea-it-times",
    "url": "https://www.koreaittimes.com/news/articleView.html?idxno=159121"
  },
  "original_language": "en",
  "account": "Samsung Electronics Chairman Lee Jae-yong announced a 46 trillion won investment plan to convert Samsung’s Onyang Campus in Asan, Chungcheong Province, into a leading advanced packaging hub for high-bandwidth memory (HBM) chips, a critical component in artificial intelligence (AI) technology. Over the next phases, Samsung plans to construct five HBM production lines, converting the current semiconductor assembly and testing facility into a modern HBM manufacturing base. During the campus's groundbreaking ceremony, Lee emphasized the shift from a traditional semiconductor assembly and testing site to a cutting-edge HBM hub, describing it as the \"heart of AI semiconductors.\" The company will allocate 6 trillion won to construction and 40 trillion won to advanced equipment, culminating in a campus expansion from 270,000 to approximately 420,000 square meters, an increase of about 60%. Once operational in June 2028, the new facility will generate around 700 direct jobs. The project is part of a broader strategy to enhance Samsung's competitiveness in the advanced packaging sector, aligning with the growing demand for AI accelerators and data centers. Samsung's investment also aims to bolster the semiconductor ecosystem in the Chungcheong region, combining existing infrastructure in Cheonan and Asan with new HBM capabilities.",
  "summary": "Samsung Electronics Chairman Lee Jae-yong has unveiled plans to transform the company's Onyang Campus in Asan, South Chungcheong Province, into a major advanced packaging hub for high-bandwidth memory (HBM), a key semiconductor for artificial intelligence (AI).Samsung Electronics plans to invest a total of 46 trillion won in the campus in phases and build five HBM production lines, turning the…",
  "key_points": [
    "Samsung CEO Lee Jae-yong pledges 46 trillion won investment.",
    "Campus in Asan, Chungcheong Province to become HBM hub.",
    "Facility to open in June 2028, creating 700 jobs."
  ],
  "editors_take": "Converting the Onyang Campus into a specialized high-bandwidth memory hub signals Samsung's strategic pivot toward securing dominance in the advanced packaging sector required to meet surging artificial intelligence demand.",
  "illustration": null,
  "coverage": {
    "outlets": 1,
    "also_reported_by": []
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}