{
  "id": 19347547,
  "title": "Staera launches with $4.6M to develop an optical interconnect for chiplets",
  "url": "https://urgent.news/2026/11/10/staera-launches-with-4-6m-to-develop-an-optical-interconnect-for",
  "topic": "tech",
  "section": "Tech",
  "published": "2026-11-10T15:00:31.000Z",
  "source": {
    "name": "SiliconANGLE",
    "slug": "siliconangle",
    "url": "https://siliconangle.com/2026/11/10/staera-launches-with-4-6m-to-develop-an-optical-interconnect-for-chiplets/"
  },
  "original_language": "en",
  "account": "Staera Semiconductor Inc., a startup based in San Francisco, has raised $4.6 million in pre-seed funding to develop an optical interconnect for chiplets. The investment was led by Singaporean fund Openspace Capital and joined by SGInnovate, Black Kite Capital, 28 Holdings, In Group, and financial software company Decimus Technologies. Chiplets, which are silicon dies that each perform a specific task, are often linked together by interposers or bridges using tiny copper wires. However, these wires can be slow and power-hungry over longer distances required for AI accelerators. Staera hopes to replace these copper connections with optical links. Their first product, Lightwire, uses silicon nitride, a transparent material that supports a wider range of wavelengths and causes less light loss, to transmit data at up to 8 gigabits per second. This technology can provide over 600 optical links per square millimeter, allowing for significantly faster data transfer rates in HBM4 memory stacks. Staera plans to use the funding to enhance Lightwire, expand its U.S. team, and build a manufacturing supply chain, with the goal of starting commercial shipments in 2030.",
  "summary": "Staera Semiconductor Inc., a startup that develops technology for linking together chiplets, launched today with $4.6 million in pre-seed funding. Singaporean fund Openspace Capital led the investment. It was joined by SGInnovate, Black Kite Capital, 28 Holdings, In Group and financial software company Decimus Technologies. High-end artificial intelligence accelerators comprise multiple chiplets,…",
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 1,
    "also_reported_by": []
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}