{
  "id": 19047463,
  "title": "AI Chip Race Moves Beyond HBM to Advanced Packaging",
  "url": "https://urgent.news/2026/11/09/ai-chip-race-moves-beyond-hbm-to-advanced-packaging",
  "topic": "tech",
  "section": "Tech",
  "published": "2026-11-09T00:04:51.000Z",
  "source": {
    "name": "Korea IT Times",
    "slug": "korea-it-times",
    "url": "https://www.koreaittimes.com/news/articleView.html?idxno=158916"
  },
  "original_language": "en",
  "account": null,
  "summary": "The global artificial intelligence semiconductor race is witnessing a shift from high-bandwidth memory (HBM) to advanced packaging as a critical factor in the industry's competitiveness. As AI accelerators become more powerful and incorporate larger amounts of HBM, the need for reliable and efficient packaging capacity to integrate these components has become increasingly important. Samsung Electronics and SK hynix are particularly focused on delivering memory that can be seamlessly integrated into customers' AI systems. The advanced packaging industry is projected to surpass conventional packaging revenue by 2026, with capital expenditures reaching around $28 billion, according to research firm Yole Group. TSMC, through its Chip-on-Wafer-on-Substrate (CoWoS) packaging technology, has established a dominant position in both advanced foundry manufacturing and packaging, with plans to introduce larger 14-reticle platforms to accommodate more computing chips and HBM stacks. However, the increasing demand for advanced packaging has put pressure on TSMC's capacity, driving AI chip companies to explore alternative manufacturing options and diversify their supply chains.",
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 1,
    "also_reported_by": []
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}