{
  "id": 1543227,
  "title": "Leaker details A20 Pro chip’s new speed gains",
  "url": "https://urgent.news/2026/08/17/leaker-details-a20-pro-chips-new-speed-gains",
  "topic": "tech",
  "section": "Tech",
  "published": "2026-08-17T19:13:55.000Z",
  "source": {
    "name": "9to5Mac",
    "slug": "9to5mac",
    "url": "https://9to5mac.com/2026/08/17/leaker-details-a20-pro-chips-new-speed-gains/"
  },
  "original_language": "en",
  "account": "Next month, Apple is set to unveil the iPhone 18 Pro and iPhone Ultra, equipped with the A20 Pro chip. According to supply chain sources, this new chip will boast significant performance improvements over its predecessor, the A19 Pro. Reputable leaker Fixed Focus Digital revealed these expected enhancements on Weibo over the weekend.\n\nThe A20 Pro will be the first Apple chip fabricated using TSMC's advanced 2nm process. Additionally, it is rumored to employ a novel Wafer-Level Multi-Chip Module (WMCM) packaging technique, contributing to its potential for larger performance gains. As a result, the improvements with this year's chip are anticipated to surpass usual expectations.\n\nWhile the complete breakdown of the A20 Pro's enhancements may be revealed next month, the Weibo leaker offered some insight into the expected advantages. Apple's typical practice involves dissecting these gains across the CPU, GPU, and Neural Engine. If the rumored numbers hold true, the A20 Pro is poised to deliver a substantial boost across these areas.\n\nOne area of particular interest is efficiency gains, which are expected to result in improved battery life without sacrificing performance. Coupled with iOS 27's own performance optimizations, the iPhone 18 Pro and iPhone Ultra are expected to be formidable updates in terms of speed and capabilities.",
  "summary": "iPhone 18 Pro and iPhone Ultra will be unveiled next month with a new A20 Pro chip, and this weekend a reputable leaker shared performance gains to expect per supply chain sources.",
  "key_points": [
    "A20 Pro chip will feature TSMC's advanced 2nm process.",
    "Novel Wafer-Level Multi-Chip Module packaging technique anticipated.",
    "Expected performance gains across CPU, GPU, and Neural Engine."
  ],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 1,
    "also_reported_by": []
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}