{
  "id": 14955719,
  "title": "ASML eyes hybrid bonding, report finds, as Chinese firms adopt chip packaging technique",
  "url": "https://urgent.news/2026/10/16/asml-eyes-hybrid-bonding-report-finds-as-chinese-firms-adopt-chip",
  "topic": "tech",
  "section": "Tech",
  "published": "2026-10-16T12:30:12.000Z",
  "source": {
    "name": "South China Morning Post",
    "slug": "south-china-morning-post",
    "url": "https://www.scmp.com/tech/tech-trends/article/3371181/asml-eyes-hybrid-bonding-report-finds-chinese-firms-adopt-chip-packaging-technique"
  },
  "original_language": "en",
  "account": "ASML, a leading Dutch semiconductor equipment manufacturer, is exploring hybrid bonding technology, a method that enables dense electrical connections by directly joining chips or silicon wafers. Major Chinese firms are also adopting this technique to enhance chip performance, according to a report by SemiAnalysis. Between December 2022 and November 2024, ASML filed 27 patent families related to hybrid bonding tools, potentially indicating a broader scope of progress than initially disclosed. The company is reportedly collaborating with Dutch tech firms Prodrive Technologies and VDL ETG to develop the architecture for a hybrid bonder. ASML CEO Christophe Fouquet hinted at ongoing efforts to support customers in hybrid bonding during an April earnings call. Hybrid bonding allows for ultra-high-density electrical connections and is considered a significant trend in chipmaking. Chinese tech giants Huawei and ChangXin Memory Technologies have utilized hybrid bonding to improve performance amid US-led export restrictions on advanced semiconductor equipment. The technique can reduce thermal resistance in high-bandwidth memory stacks by up to 30%, potentially lowering cooling requirements. However, China remains reliant on imported hybrid bonding equipment, with domestic manufacturers striving to reduce the gap.",
  "summary": "Dutch semiconductor equipment giant ASML is expanding into next-generation hybrid bonding, a technique that creates dense electrical connections by directly joining chips or silicon wafers, according to a new report. Major Chinese companies are also adopting the technology to improve chip performance. ASML submitted 27 patent families related to hybrid bonding tools between December 2022 and…",
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 2,
    "also_reported_by": [
      {
        "outlet": "SCMP Tech",
        "title": "ASML eyes hybrid bonding, report finds, as Chinese firms adopt chip packaging technique",
        "url": "https://urgent.news/2026/10/16/asml-eyes-hybrid-bonding-report-finds-as-chinese-firms-adopt-chip-14957818",
        "published": "2026-10-16T12:30:12.000Z"
      }
    ]
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}