{
  "id": 137377,
  "title": "Kioxia and Sandisk demonstrate the world's highest-density 3D NAND flash — 332 active layers and up to 4,800 MT/s interface",
  "url": "https://urgent.news/2026/08/04/kioxia-and-sandisk-demonstrate-the-worlds-highest-density-3d-nand",
  "topic": "tech",
  "section": "Tech",
  "published": "2026-08-04T16:15:42.000Z",
  "source": {
    "name": "Tom's Hardware",
    "slug": "tom-s-hardware",
    "url": "https://www.tomshardware.com/pc-components/ssds/kioxia-and-sandisk-demonstrate-the-worlds-highest-density-3d-nand-flash-332-active-layers-and-up-to-4-800-mt-s-interface"
  },
  "original_language": "en",
  "account": "Kioxia and Sandisk showcased the world's highest-density 3D NAND flash technology at the Future of Memory and Storage Conference. The new BiCS10 3D QLC NAND device, boasting 332 active layers and a maximum interface speed of 4,800 MT/s, breaks the record for areal density at 37 Gb/mm². As part of Kioxia's and Sandisk's BiCS 3D QLC NAND progression, this innovation outperforms their previous BiCS10 3D TLC NAND device, which achieved over 29 Gb/mm². Although the IC's total capacity is undisclosed, estimates predict a capacity of 1.33 Tb, based on comparisons with the recently launched 1 Tb BiCS10 3D TLC NAND chip. By introducing this record-breaking 332-layer memory device, Kioxia and Sandisk aim to cater to high-capacity data center-grade solid-state drives that seek to maximize storage density while maintaining high performance and lower power consumption. The companies' implementation of the power-isolated low-tapped termination (PI-LTT) technique further aids in reducing power consumption without compromising signal integrity. Kioxia and Sandisk's commitment to this advanced 3D NAND technology will likely lead to ultra-high-capacity SSDs at competitive prices or increased margins through similar pricing structures.",
  "summary": "Kioxia and Sandisk introduce BiCS10 3D QLC NAND device with a record areal density of over 37 Gbit/mm^2.",
  "key_points": [
    "Kioxia and Sandisk unveil 332-layer 3D NAND flash at conference",
    "BiCS10 3D QLC NAND achieves 37 Gb/mm² areal density",
    "Power-efficient PI-LTT technique reduces power consumption"
  ],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 2,
    "also_reported_by": [
      {
        "outlet": "Tom's Hardware",
        "title": "New HBF spec outlines tech that can give GPUs terabytes of extra memory — Sandisk and SK hynix unveil spec with up to 16-Hi NAND stacks, 3 TB/s bandwidth, UCIe",
        "url": "https://urgent.news/2026/08/04/new-hbf-spec-outlines-tech-that-can-give-gpus-terabytes-of-extra",
        "published": "2026-08-04T14:42:58.000Z"
      }
    ]
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}