{
  "id": 12931059,
  "title": "GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion",
  "url": "https://urgent.news/2026/10/08/globalfoundries-to-produce-silicon-interposers-for-tsmcs-cowos-in-the",
  "topic": "tech",
  "section": "Tech",
  "published": "2026-10-08T18:23:28.000Z",
  "source": {
    "name": "Tom's Hardware",
    "slug": "tom-s-hardware",
    "url": "https://www.tomshardware.com/tech-industry/semiconductors/globalfoundries-to-produce-silicon-interposers-for-tsmcs-cowos-in-the-us-five-year-agreement-valued-at-usd2-billion"
  },
  "original_language": "en",
  "account": "GlobalFoundries and TSMC have signed a five-year, $2 billion agreement to produce silicon interposers for TSMC's CoWoS advanced packaging technology in the United States. This manufacturing deal will provide a domestic source of these components, allowing TSMC's clients to market their products as entirely made and packaged in America. Volume production is expected to commence in the first half of 2028.\n\nEd Kaste, GlobalFoundries' senior vice president of CMOS Business, stated that the partnership aims to create a secure and scalable source of critical advanced-packaging elements, thus accelerating innovation and strengthening the semiconductor supply chain. The agreement entails GlobalFoundries expanding its manufacturing capacity at its facility in Malta, NY, to create silicon interposers for TSMC's CoWoS-S packaging ecosystem. These interposers, which are custom silicon pieces, facilitate high-density connections between logic chiplets and high-bandwidth memory (HBM) stacks, enabling the creation of intricate multi-die processors for artificial intelligence (AI) and high-performance computing (HPC) applications.\n\nThe specific production capacity to be installed is not disclosed, but the agreement allows for future expansion based on demand. Silicon interposers for TSMC's CoWoS-S technology are tailored to individual processor designs, with configurations depending on the arrangement, dimensions, placement, and interconnections of logic chiplets and HBM stacks. These interposers must also meet the power-delivery requirements of specific processors, including power distribution networks and embedded deep trench capacitors (DTC). Their designs must account for signal integrity, power integrity, and thermal characteristics. Given the potential size of large interposers, they may exceed maximum lithographic reticle size and necessitate stitching.\n\nGlobalFoundries will not be a TSMC supplier but rather a subcontractor manufacturing customer-specific interposer designs. The companies need to ensure compatibility between their design rules, manufacturing processes, and qualification procedures to enable successful integration of GF-produced interposers into TSMC's CoWoS packaging flows. Ownership and protection of intellectual property may also need to be addressed, as interposer layouts could incorporate technologies and production methods unique to TSMC and its customers.\n\nBy transferring some interposer production to GlobalFoundries, TSMC could conserve some of its own manufacturing resources and increase the availability of essential components for advanced packaging. The agreement represents an opportunity for GlobalFoundries to participate in the manufacturing of advanced AI processors without producing the leading-edge logic dies. However, it remains to be seen whether GlobalFoundries will also engage in TSMC's CoWoS-L supply chain.",
  "summary": "GlobalFoundries becomes a part of TSMC's CoWoS supply chain in the U.S.: set to participate in production of leading-edge AI and HPC accelerators without investing in leading-edge process technologies.",
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 4,
    "also_reported_by": [
      {
        "outlet": "The National Business",
        "title": "UAE-backed GlobalFoundries and TSMC announce $2bn manufacturing agreement",
        "url": "https://urgent.news/2026/10/08/uae-backed-globalfoundries-and-tsmc-announce-2bn-manufacturing",
        "published": "2026-10-08T15:15:46.000Z"
      },
      {
        "outlet": "Techmeme",
        "title": "GlobalFoundries signs a five-year, $2B deal to provide silicon interposer production capacity to TSMC, manufactured at GlobalFoundries' New York facility (Ian King/Bloomberg)",
        "url": "https://urgent.news/2026/10/08/globalfoundries-signs-a-five-year-2b-deal-to-provide-silicon",
        "published": "2026-10-08T16:10:00.000Z"
      },
      {
        "outlet": "The Register",
        "title": "TSMC taps GlobalFoundries to bolster US silicon interposer production in $2B deal",
        "url": "https://urgent.news/2026/10/08/tsmc-taps-globalfoundries-to-bolster-us-silicon-interposer-production",
        "published": "2026-10-08T17:22:32.000Z"
      }
    ]
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}