{
  "id": 11317252,
  "title": "LG Electronics Targets AI Data Center Cooling Market with U.S., Korea Capacity Expansion",
  "url": "https://urgent.news/2026/10/02/lg-electronics-targets-ai-data-center-cooling-market-with-u-s-korea",
  "topic": "business",
  "section": "Business",
  "published": "2026-10-02T00:44:52.000Z",
  "source": {
    "name": "Korea IT Times",
    "slug": "korea-it-times",
    "url": "https://www.koreaittimes.com/news/articleView.html?idxno=157762"
  },
  "original_language": "en",
  "account": null,
  "summary": "LG Electronics is expanding its production capacity in both the United States and South Korea to target the growing AI data center cooling market. The company plans to build a chiller manufacturing plant in Windsor, Virginia, which will begin production in the first half of next year. This facility will primarily produce air-cooled chillers for AI data centers and covers approximately 32,000 square meters of floor space on a 170,000-square-meter site. The investment is aimed at establishing a local supply base closer to North American data center customers. In addition to the U.S. expansion, LG Electronics is also modernizing its domestic production infrastructure in South Korea, with plans to add air-cooled chiller production lines and upgrade manufacturing equipment at its plants in Pyeongtaek and Changwon. The total investment in these projects is expected to reach approximately 150 billion won ($110 million). Industry experts believe that cooling infrastructure is becoming a critical component of AI data center expansion, as operators seek to manage the higher heat loads generated by advanced computing systems. By establishing local production in North America, LG Electronics aims to improve supply stability and respond more quickly to growing demand in the region. The company is also broadening its data center cooling portfolio beyond chillers by expanding its business around liquid-cooling solutions, including coolant distribution units (CDUs) and cold plates that directly absorb heat generated by semiconductor chips. The company's \"Chip to Chiller\" strategy connects cooling technologies from the chip level to the chiller, allowing it to offer integrated thermal management solutions for data center operators.",
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 1,
    "also_reported_by": []
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}