{
  "id": 10629877,
  "title": "Samsung Electronics says HBM to account for nearly 30% of industry DRAM capacity next year",
  "url": "https://urgent.news/2026/09/29/samsung-electronics-says-hbm-to-account-for-nearly-30-of-industry-10629877",
  "topic": "business",
  "section": "Business",
  "published": "2026-09-29T06:39:04.000Z",
  "source": {
    "name": "Business Recorder",
    "slug": "business-recorder",
    "url": "https://www.brecorder.com/news/40441772/samsung-electronics-says-hbm-to-account-for-nearly-30-of-industry-dram-capacity-next-year"
  },
  "original_language": "en",
  "account": null,
  "summary": "SEOUL: A Samsung Electronics executive said on Tuesday that high-bandwidth memory (HBM) is expected to account for nearly 30% of Dynamic Random-Access Memory (DRAM) chipmakers’ total wafer capacity next year, up from about 20% currently. Samsung Electronics Executive Vice President Kim Taewoo said HBM and standard DRAM compete for the same wafer capacity, meaning expanding HBM output could…",
  "key_points": [],
  "editors_take": null,
  "illustration": null,
  "coverage": {
    "outlets": 2,
    "also_reported_by": [
      {
        "outlet": "CNA - Business",
        "title": "Samsung Electronics says HBM to account for nearly 30% of industry DRAM capacity next year",
        "url": "https://urgent.news/2026/09/29/samsung-electronics-says-hbm-to-account-for-nearly-30-of-industry",
        "published": "2026-09-29T01:07:39.000Z"
      }
    ]
  },
  "ai_generated": true,
  "disclaimer": "Summaries, key points and the editor’s take are written by software from other outlets’ reporting and may contain errors — always check the linked original."
}